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Model:LQG15WZ1N0B02D

Model:LQG15WZ1N0B02D
Manufacturer:Murata Manufacturing Co., Ltd. 
Stocks:2000
Describe:

LQG15WZ1N0B02D is a high-Q multi-layer RF inductor launched by Murata Manufacturing. It adopts 0402 (1005 metric) ultra-small surface mount packaging. This component belongs to the LQG15WZ_02 series and is specifically designed for high-frequency circuit applications that require high precision and high stability in inductance values. 
This inductor possesses two core characteristics: extremely low inductance value and extremely high self-resonant frequency. Its main performance parameters are as follows: nominal inductance value is 1nH, inductance tolerance is ±0.1nH, it uses air core, and has a multi-layer structure. The self-resonant frequency (SRF) is as high as 15GHz, the maximum DC resistance (DCR) is 30mΩ, and the rated current (Ir) is up to 1.2A. 
This device is unshielded (non-shielded type), and its operating temperature range is from -55°C to +125°C. It has passed the AEC-Q200 automotive-grade certification and meets the reliability requirements for automotive electronics.
Features :

• Product type: Multi-layer RF inductor, air core, unshielded 
• Inductance: 1 nH ± 0.1 nH 
• Rated current (Ir): 1.2A 
• Direct Current Resistance (DCR): Maximum 30 mΩ 
• Self-resonant frequency (SRF): 15 GHz 
• Q value: The typical value is not specified. This is a high-Q design. 
• Test frequency: 100 MHz 
• Vehicle-grade certification: Obtained AEC-Q200 certification (applicable to applications such as automotive infotainment) 
• Operating temperature range: -55°C to +125°C 
• Ultra-small package: 0402 (1005 metric), size 1.00mm × 0.50mm × 0.50mm 
• Environmental compliance: Meets RoHS standards, lead-free 
• Product status: Active (In production) 
• Packaging method: Tape & Reel, 10,000 pieces per roll
Application:

• Automotive electronics: Applications such as in-vehicle infotainment systems and comfort equipment that meet the AEC-Q200 certification requirements 
• High-frequency RF circuits: RF matching network, antenna matching, PA output matching 
• Wireless communication equipment: Bluetooth, WLAN, GPS, 5G and other high-frequency modules 
• Smartphones and wearable devices: Portable products requiring miniaturization and high-frequency performance 
• Industrial Internet of Things: High-Frequency Interfaces of Wireless Sensor Nodes