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Model:DF40C-24DS- 0 . 4V

Model:DF40C-24DS- 0 . 4V
Manufacturer:Hirose Electric 
Stocks:8000
Describe:

0.4mm pitch, 24-bit dual-row board-to-board/ board-to-FPC connector sockets, with surface mount (stick-on) design. This device belongs to the DF40 series and supports various stacking heights ranging from 1.5mm to 4.0mm (the standard height of this model is 1.5mm). It features high-density installation characteristics. The transmission speed can reach up to 20.0 Gbps, and it is compatible with various high-speed transmission standards such as USB3.1 Gen2, USB2.0, USB3.0, MIPI, SATA, PCIe, etc. It adopts a locking system, which emits a clear click sound to ensure a perfect fit, and it also has a anti-soldering structure and anti-pollution design. It is suitable for applications in smartphones, wearable devices, industrial automation, automotive electronics, etc. that require high-density and high-speed signal transmission.
Features :

• Basic parameters: 24-bit (24PIN) dual-row design, pitch 0.4mm, pitch between rows 0.4mm, socket type (female), with contact structure in the center 
• Stacking height: 1.5mm (fixed), the DF40 series also supports various height options such as 2.0mm, 2.5mm, 3.0mm, 3.5mm, and 4.0mm. 
• Rated current and voltage: Rated current 0.3A (300mA), Rated voltage 50V AC/DC 
• Contact resistance and withstand voltage: Contact resistance: Maximum 90 mΩ, Withstand voltage: Maximum 150V 
• High-speed transmission capability: Transmission speed 20.0 Gbps, compatible with USB3.1 Gen2, USB3.0, MIPI, SATA, PCIe and other protocols. 
• High contact reliability: With a stack height of 1.5mm, the effective cooperation length is 0.45mm. The locking system prevents accidental disengagement, and a clear clicking sound is provided during the cooperation process. 
• Outstanding self-aligning capability: With the use of guiding ribs, the self-aligning range is 0.33mm, reducing the requirements for mounting accuracy. 
• Anti-soldering tin structure: A nickel coating barrier protects the contact area from potential solder migration. 
• Anti-pollution design: The contacts are covered during assembly to prevent dust and debris from entering; The SMT leads are closely attached to the housing to reduce the risk of short circuits. 
• Wide operating temperature range: Industrial grade temperature range -55°C to +85°C (some sources indicate -35°C to +85°C) 
• Package dimensions: Connector length 7.4mm, width 3.38mm, height 1.45mm, weight 0.037g 
• Number of insertions and removals: 30 times 
• Environmental compliance: Meets RoHS standards, lead-free, MSL grade 1 (unrestricted)
 
Application:

• Smartphones and wearable devices (smart watches, fitness bands, AR/VR glasses) 
• Tablet computers and notebook computers (PC & Tablet) 
• Industrial Automation and Robot Control Systems 
• Automotive electronics (in-vehicle infotainment systems, ADAS, autonomous driving-related modules) 
• Communication equipment (routers, switches, base station modules) 
• Medical equipment (monitoring devices, ultrasound equipment, portable diagnostic instruments) 
• Consumer electronics (smart speakers, game consoles, digital cameras) 
• Testing and measurement equipment (oscilloscopes, signal generators) 
• Internet of Things (IoT) gateway and sensor node